LEAPMOTOR and Qualcomm Technologies, Inc. announce today that the companies have signed a non-binding Memorandum of Understanding (MOU) on strategic cooperation to further deepen collaborations in the automotive sector. The companies will strategically collaborate to create the new generation of intelligent cockpit product for LEAPMOTOR’s future vehicles based on the latest next generation Snapdragon® Cockpit Platforms from Qualcomm Technologies. LEAPMOTOR is expected to be one of the first automakers that utilize the platform, with the first LEAPMOTOR vehicle planning to adopt this solution to launch this year. As a part of the technology collaboration, the companies will also explore extensive collaboration opportunities on cockpit, automotive connectivity and intelligent driving with Snapdragon® Digital Chassis™ solutions for LEAPMOTOR’s future vehicles.
The next generation Snapdragon Cockpit Platform that is expected to be utilized by LEAPMOTOR is Qualcomm Technologies’ premium digital cockpit solution and serves as the company’s automotive-grade solution built using 5nm process node. This platform leverages the 6th Generation Qualcomm® Kryo™ CPU with high-performance compute, Qualcomm® Adreno™ GPU with leading graphics rendering capabilities and premium Qualcomm® Artificial Intelligence (AI) Engine. With the leading process node and powerful AI compute, graphics and multimedia capabilities, this platform provides the underlying foundation for LEAPMOTOR’s new-generation cockpit platform to bring premium experiences in intelligent voice processing, heavy-workload multi-tasking, complicated multimedia, contextual awareness and security enhancement.
The next generation Snapdragon Cockpit Platform supports the fusion of multiple electronic control units (ECUs) and domains, including cluster and cockpit, AR-HUD, infotainment, rear-seat displays, e-mirrors and in-cabin monitoring. Also, the platform was designed from the ground up to support the integration of multiple distributed computing components in the vehicle, aligning with the central-compute electrical/electronic (E/E) architecture and is designed to further support LEAPMOTOR’s new-generation intelligent connected vehicles to evolve toward the central-compute architecture. LEAPMOTOR will also plan to utilize the Snapdragon® Car-to-Cloud Services’ Soft-SKU capabilities, allowing consumers to continuously enjoy the latest features and capabilities with over-the-air (OTA) updates throughout the vehicle’s lifecycle, and extend the imagination of the entire cockpit experience.
“As one of the first automakers utilizing the previous generation of the Snapdragon Cockpit Platform in production vehicles, LEAPMOTOR has realized three-screen interaction by one chip through innovative technology based on its development of cockpit advantages, as well as integrated with four surround-view cameras and ARKAMYS tuning,” said Hongtao Zhou, senior vice president and head of electronic product line, LEAPMOTOR. “Today, the complete series of LEAPMOTOR C11/C01 are equipped with Snapdragon Cockpit Platforms, bringing users powerful computing capabilities, smooth in-vehicle operation experiences and rich infotainment applications; based on the companies’ new technology collaboration, LEAPMOTOR is expected to be one of the first automakers that utilize the next generation Snapdragon Cockpit Platform in production vehicles to create greater value in safe mobility and smart life for users.”
“As the premium automotive-grade solution for intelligent, connected vehicles, the next generation Snapdragon Cockpit Platforms have raised the bar for in-vehicle experiences in the industry and helped automakers and Tier-1 suppliers bring more differentiated features, improved safety and richer use cases to users,” said Nakul Duggal, senior vice president and GM, automotive, Qualcomm Technologies, Inc. “Building on LEAPMOTOR’s in-depth technical accumulation in the field of independent research & development and the cooperation between our companies, we look forward to sharing premium, immersive driving experiences with users utilizing the latest solutions from the Snapdragon Digital Chassis.”
Source : Qualcomm
