HomeTagsNXP

Tag: NXP

Automotive Chip

TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe

editor - 04/09/2023

TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced...

Automotive Chip

The quick, easy, and cost-effective path to market for dual-band Wi-Fi 4 and Bluetooth 5 combo applications

editor - 16/03/2021

The MAYA-W1 multiradio module stands out for its compact size, design flexibility, and ease of integration.

[td_block_social_counter facebook=”TagDiv” twitter=”tagdivofficial” youtube=”tagdiv” style=”style4 td-social-colored” custom_title=”FOLLOW US” block_template_id=”td_block_template_2″ f_header_font_family=”445″ f_header_font_size=”18″ f_header_font_line_height=”1.4″ f_header_font_transform=”uppercase” header_text_color=”#f45511″ f_header_font_weight=”400″ tdc_css=”eyJhbGwiOnsiZGlzcGxheSI6IiJ9LCJwb3J0cmFpdCI6eyJtYXJnaW4tYm90dG9tIjoiNDAiLCJkaXNwbGF5IjoiIn0sInBvcnRyYWl0X21heF93aWR0aCI6MTAxOCwicG9ydHJhaXRfbWluX3dpZHRoIjo3Njh9″]

Tag: NXP

TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe

The quick, easy, and cost-effective path to market for dual-band Wi-Fi 4 and Bluetooth 5 combo applications

LATEST POSTS

TIER IV launches L4 RIDE to boost rollout of autonomous bus services

Unveiling 360° Future Mobility: Taipei AMPA, AutoTronics Taipei, and 2035 E-Mobility Taiwan Grandly Opens

Dual Engines Driving ADAS Growth—Regulation and AI Intelligence

All-Electric 2024 Honda Prologue Qualifies for $7,500 U.S. EV Tax Credit

Toyota Alabama Powers Up a Newi-FORCE Engine Line

About Us

Topic

Product Categories

Media Partners