The Snapdragon X80 5G Modem-RF System is the most advanced modem-to-antenna platform, fusing artificial intelligence with unparalleled spectrum flexibility, power efficiency, and performance. The Snapdragon...

Automotive Chip

Automotive Semiconductors: The Driving Force Behind Electric Vehicle Proliferation

editor - 21/02/2024

The electric vehicle market is expected to continue its growth this year, with an estimated compound annual growth rate (CAGR) of approximately 20% by...

Automotive Chip

u-blox spearheads a Wi‑Fi 6/E and Bluetooth® 5.4 with LE Audio solution for industrial applications

editor - 02/11/2023

The u-blox MAYA-W3 brings the benefits of Wi-Fi 6 and the 6 GHz band to industrial applications, preventing network congestion and ensuring power efficiency. Thalwil,...

Automotive Chip

STMicroelectronics’ automotive power-management ICs integrate CAN FD and LIN for simpler car-body controllers

editor - 01/11/2023

STMicroelectronics’ SPSB081 automotive power-management IC is a Swiss Army Knife of features including a main fixed-voltage low-dropout regulator (LDO), a secondary programmable LDO, four high-side drivers,...

Automotive Chip

u-blox introduces the smallest single-mode LTE Cat 1bis IoT module

editor - 03/10/2023

The u-blox LEXI-R10 is an ultra-compact module for applications requiring medium data rates. u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies...

Automotive Chip

TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe

editor - 04/09/2023

TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced...

Automotive Chip

Qualcomm Announces New Product Longevity Program for its Industrial and Enterprise IoT Portfolio

editor - 01/09/2023

New program demonstrates commitment from Qualcomm Technologies to customers with products that require a longer lifespan. ● Featuring more than a dozen IoT-specialized chips, the...

Automotive Chip

STMicroelectronics’ GNSS module eases design with Teseo single-die receiver technology for sub-meter accuracy

editor - 30/08/2023

The STMicroelectronics Teseo-LIV4F GNSS module leverages ST’s Teseo IV single-die receiver technology, including L1 and L5 frequency-band support, to provide positioning accuracy better than...

Automotive Chip

u-blox introduces the smallest LTE-M / NB-IoT module with 23dBm RF output power and 2G fallback

editor - 20/07/2023

The u-blox LEXI-R4 is the newest compact 16 x16 mm module with 2G fallback capability. u-blox (SIX:UBXN), a global provider of leading positioning and wireless...

5G&AIOT

u-blox introduces its newest dual-band Wi-Fi 6 and dual-mode Bluetooth® 5.3 module.

editor - 10/07/2023

The u-blox JODY-W5 is an automotive-grade module with Bluetooth LE audio in a compact form factor withstanding temperatures up to 105 °C. Thalwil, Switzerland –...

Automotive Chip

u-blox announces two new high-precision GNSS positioning modules based on the successful F9 platform

editor - 26/06/2023

The NEO-F9P enables precise navigation and automation of moving industrial machinery, while the ZED-F9P-15B offers customers in the mobile robotics market an L1/L5 alternative...

5G&AIOT

Axiado Samples World’s First AI-Driven Security Processors

editor - 30/05/2023

Single-chip trusted control/compute unit (TCU) provides theindustry’s most robust, hardware-anchored solution for detectingcyberattacks on next-generation servers in data centers, 5Ginfrastructure, and network switches COMPUTEX 2023...

Automotive Chip

STMicroelectronics releases 750W motor-drive reference board in tiny outline for home and industrial equipment

u-blox high-precision positioning solutions now available on NVIDIA® Jetson™ Edge AI and NVIDIA DRIVE Hyperion™ platforms

STMicroelectronics reveals automotive-grade inertial modules for cost-effective functional-safety applications up to ASIL B

Qualcomm Announces Breakthrough Wi-Fi Technology and Introduces New AI-Ready IoT and Industrial Platforms at Embedded World 2024

u-blox launches new GNSS platform for enhanced positioning accuracy in urban environments

Qualcomm Unveils the World’s Most Advanced 5G Modem-RF System, Harnessing Integrated AI to Enable the Next Generation of 5G

Automotive Semiconductors: The Driving Force Behind Electric Vehicle Proliferation

u-blox spearheads a Wi‑Fi 6/E and Bluetooth® 5.4 with LE Audio solution for industrial applications

STMicroelectronics’ automotive power-management ICs integrate CAN FD and LIN for simpler car-body controllers

u-blox introduces the smallest single-mode LTE Cat 1bis IoT module

TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe

Qualcomm Announces New Product Longevity Program for its Industrial and Enterprise IoT Portfolio

STMicroelectronics’ GNSS module eases design with Teseo single-die receiver technology for sub-meter accuracy

u-blox introduces the smallest LTE-M / NB-IoT module with 23dBm RF output power and 2G fallback

u-blox introduces its newest dual-band Wi-Fi 6 and dual-mode Bluetooth® 5.3 module.

u-blox announces two new high-precision GNSS positioning modules based on the successful F9 platform

Axiado Samples World’s First AI-Driven Security Processors

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