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Qualcomm Announces Breakthrough Wi-Fi Technology and Introduces New AI-Ready IoT and Industrial Platforms at Embedded World 2024

Highlights: Qualcomm Technologies’ leadership in connectivity, high performance, low power processing, and on-device AI position is at the center of the digital transformation of many...

u-blox launches new GNSS platform for enhanced positioning accuracy in urban environments

The u-blox F10 platform increases positioning accuracy by reducing multipath effects, simplifying the process of promptly locating a vehicle. Thalwil, Switzerland – April 1, 2024...

Qualcomm Unveils the World’s Most Advanced 5G Modem-RF System, Harnessing Integrated AI to Enable the Next Generation of 5G

The Snapdragon X80 5G Modem-RF System is the most advanced modem-to-antenna platform, fusing artificial intelligence with unparalleled spectrum flexibility, power efficiency, and performance. The Snapdragon...

Automotive Semiconductors: The Driving Force Behind Electric Vehicle Proliferation

The electric vehicle market is expected to continue its growth this year, with an estimated compound annual growth rate (CAGR) of approximately 20% by...

u-blox spearheads a Wi‑Fi 6/E and Bluetooth® 5.4 with LE Audio solution for industrial applications

The u-blox MAYA-W3 brings the benefits of Wi-Fi 6 and the 6 GHz band to industrial applications, preventing network congestion and ensuring power efficiency. Thalwil,...

STMicroelectronics’ automotive power-management ICs integrate CAN FD and LIN for simpler car-body controllers

STMicroelectronics’ SPSB081 automotive power-management IC is a Swiss Army Knife of features including a main fixed-voltage low-dropout regulator (LDO), a secondary programmable LDO, four high-side drivers,...

u-blox introduces the smallest single-mode LTE Cat 1bis IoT module

The u-blox LEXI-R10 is an ultra-compact module for applications requiring medium data rates. u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies...

TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe

TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced...

Qualcomm Announces New Product Longevity Program for its Industrial and Enterprise IoT Portfolio

 New program demonstrates commitment from Qualcomm Technologies to customers with products that require a longer lifespan. ● Featuring more than a dozen IoT-specialized chips, the...

STMicroelectronics’ GNSS module eases design with Teseo single-die receiver technology for sub-meter accuracy

The STMicroelectronics Teseo-LIV4F GNSS module leverages ST’s Teseo IV single-die receiver technology, including L1 and L5 frequency-band support, to provide positioning accuracy better than...

u-blox introduces the smallest LTE-M / NB-IoT module with 23dBm RF output power and 2G fallback

The u-blox LEXI-R4 is the newest compact 16 x16 mm module with 2G fallback capability. u-blox (SIX:UBXN), a global provider of leading positioning and wireless...

u-blox introduces its newest dual-band Wi-Fi 6 and dual-mode Bluetooth® 5.3 module.

The u-blox JODY-W5 is an automotive-grade module with Bluetooth LE audio in a compact form factor withstanding temperatures up to 105 °C. Thalwil, Switzerland –...

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